Trusted for Quality, Delivery, and Outstanding Service since 1993.

About SQAI

Established in 1993, SQAI is a pioneer manufacturer of Flexible Printed Circuits (FPC) and Integrated Circuit Substrates (ICS) in Malaysia.

SQ Advanced Interconnect Berhad (SQAI) is the holding company of the Qdos Group in Malaysia and the Suiwa Group in China.

Qdos, headquartered in Penang, is a pioneer manufacturer of Flexible Printed Circuits (FPC) and Integrated Circuit Substrates (ICS) in Malaysia, with a legacy dating back to its establishment in 1993. Since its inception in 2005, Suiwa, based in Xiamen, has built a strong and diversified customer base across China and international markets, supported by its versatile FPC product portfolio.

Operating three highly automated, state-of-the-art manufacturing facilities, SQAI delivers comprehensive FPC and ICS solutions encompassing circuit design, prototype fabrication, mass production, and assembly. Quality, Delivery, and Outstanding Service are the core pillars underpinning SQAI operations and long-term success.

Driven by an unwavering commitment to engineering excellence in FPC and ICS, SQAI has established a strong reputation and forged long-term partnerships with numerous blue-chip multinational OEMs. Our solutions serve a broad range of industries, including telecommunications, consumer electronics, automotive, medical, semiconductor, and industrial applications, across more than 20 countries, including the United States, Germany and Japan.

Our Products

Flexible Printed
Circuit (FPC)

We provide a comprehensive range of flexible
printed circuits, including:

Integrated Circuit
Substrates (ICS)

We specialize in fine-line IC substrates using Semi-Additive Process (SAP) and build-up film. We design and manufacture a portfolio of high-end IC substrates, consisting of Coreless ABF Substrate and Sputtered-core Substrate.

Leveraging on our licensed Molded Interconnect Substrate (MIS) technology with latest process innovations, we serve a wide range of package applications including flip chip, wire bonding, thermal compression bonding, tape, SiP on the first-level interconnect, and QFN, LGA, BGA etc. on the second/SMT-level interconnect.

Build the future of flexible electronics.

Applications & Industries

Our interconnect solutions power a wide range of industries:

Medical Devices

Automotive Electronics

Communication Devices

Consumer Electronics

Semiconductors

Industrial Equipment

From concept to production, our engineering team
works closely with customers to ensure optimal performance,
manufacturability, and value across applications.