Flexible Printed
Circuits (FPC)

Ultra-thin, bendable electronic interconnects built on flexible materials to deliver reliable electrical 
connections in compact spaces. They power today’s most advanced products, from smartphones and laptops
to automotive systems and wearable technology, where space, weight, and performance matter most.

As devices become smaller, smarter, and more integrated, FPC technology plays a critical role in enabling
innovation, supporting high performance while keeping design sleek, lightweight, and efficient.

Single-sided
Double-sided
Multi-layer
Rigid-flex
What We Provide
  • Single-sided, Double-sided, Multi-layer (up to 11 Layers with Air Gap) FPCs
  • Rigid-Flex with HDI with filled copper vias (up to 8 layers)
  • Super Long FPC up to 2.5 meters for single and double layer PTH designs
  • Circuit capability: Minimum line 20um spacing 20um
  • CVL and stiffener lamination accuracy: ±0.1mm
  • Multiple Finishes, with selective & etch back options: OSP, Electrolytic Ni Au (Hard & Soft), Electrolytic Direct Au, Electrolytic NiPdAu, ENIG, ENEPIG
  • Comprehensive one-stop service from FPC to FPCA including manufacturing, assembly, testing, and packaging
Competitive Advantages
  • Multiple Production facilities across geographies to support BCP & provide geo-political options.
  • RTR production for low mix high volume projects & panel processing for high mix low volume designs to enable cost competitiveness across market segments.
  • Extensive automotive application expertise including 2-meter CCS flex, transmission box FPC, DRL FPC on aluminium substrate, toggle switch FPC, and EV power management solutions.
  • Fine line FPCs with tight tolerances on Copper thickness & mechanical features for Ultrasound Probes.
  • High-volume, cost-optimized medical consumable patches for applications such as ECG/EKG using Ag/AgCl technology.

Applications

Communication Devices
Medical Devices
Automotive Electronics
Consumer Electronics
Semiconductors
Industrial Equipment
From concept to production,
our engineering team partners closely
with customers to deliver
optimal performance, manufacturability,
and value across a wide range of applications.
Communication Devices
  • Smartphones
  • Mission critical communication devices
    • Walkie-talkies / two-way radios
  • Body-worn communication devices
  • Wireless routers
  • 5G communication modules
  • Satellite communication devices
  • Industrial wireless devices
  • Aviation communication headsets
  • Emergency vehicle communication systems
Medical Devices
  • Patient monitoring devices
  • Wearable health trackers
  • Portable ECG / EKG devices
  • Hearing aids
  • Medical imaging equipment
  • Endoscopy devices
  • Ultrasound probes
  • Surgical instruments
  • Implantable medical devices
Automotive Electronics
  • ADAS sensors and cameras
  • Parking cameras and radar modules
  • LED headlights and taillights
  • Battery management systems (EV)
  • In-vehicle communication modules
  • Door control modules
Consumer Electronics
  • DSLR Camera
  • Printer and catridge
  • AR / VR Headsets
  • Gaming Devices / Controllers
Semiconductors
  • ASIC (Application-Specific Integrated Circuits)
  • PMIC (Power Management IC)
  • MEMS (Micro Electro Mechanical Sensor)
  • Server and data center semiconductors
Industrial Equipment
  • Wire bonding machine
  • Automated Optical Inspection
  • Laser Processing Equipment