Advancing
Interconnect
Solutions for
Modern Electronics

Additively Formed
Interconnects (AFI)

The demand for modern electronics continues to rise – components need to provide more
functions in lesser space. SQAI addresses this industry requirement
by offering Additively Formed Interconnects (AFI) with Semi-Additive Process (SAP).

These technologies are crucial for applications requiring extreme miniaturization, such as
IC substrates and smartphones.  

Semi-Additive Process (SAP)

SAP uses a non-conductive substrate with an extremely thin copper layer (less than 2 μm) plated onto it.

Copper is then built up only in the open areas defined by a precise photoresist pattern to form the desired structure. After stripping the photoresist, the very thin copper layer remaining between the tracks is etched away using flash etching, leaving the desired copper pattern.

The traces have nearly perfect rectangular cross-sections with sharp and defined edges. SAP offers the best control over dimensions and trace geometry.

SAP enables ultra-fine circuit structures with
line and space down to 10 micrometers and below.

These technologies are crucial for applications requiring extreme miniaturization, such as IC substrates and AI semiconductors. This advanced technology enables ultra-fine circuit structures, aligned with future scaling roadmap of electronics world.

The precise shape of conductors from AFI technologies ensure the undistorted high-frequency signals necessary for advanced telecommunications. SAP technology excels in line and space width ranging from 75 to 10 micrometers. 

Explore Our
Capabilities (ICS)

Description
Capabilities
Unit Thickness Range
100um - 500um
Layer Count Range
1-10
Dielectric Thickness Range above Cu
40um
Thickness (20/20 L/S)
< 20um
Thickness (50/50 L/S)
< 40um
Line Space Width
15/15um
Bump Size (Non SM)
70um
Pitch Size (Non SM)
120um
Via Diameter
90um
Via Registration
20um
Solder Mask Opening (SMD)
80um
Solder Mask (Registration)
20um
Solder Mask (Thickness)
15um above Cu
Finishing
OSP, AT, NiAu, NiPdAu, Sn, ENIG, ENEPIG, Wettable flank
Material
EMC, ABF GX & LE Series, MIGC HL, MIGC PP, Taiyo SM, S. Denko SM
Supporting the Future of
Electronic Innovation
Through a strategic blend of additive and conventional manufacturing technologies, SQAI supports both legacy electronic designs and next-generation high-density interconnect requirements.
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